PCB Capabilities

What capabilities can you offer?  A questions asked us daily. The following ones are some of the capabilities and tolerances we can support you with today. However there is often room for adjustments or alternative solutions. 

This is why its smart to involve us when designing, then we can find the best solution together.  

When considering different capabilities don’t just ask for technical capabilities, but make sure to discuss combinations and how your solution affects risk of failure with multiple heat cycles required to assemble the product, and the risk of failure in the final application. 

When using combinations of various capabilities, you should always consult your Elmatica contact.

Multilayer (50+)

Mixed materials

Back Drilling

HF/RF/Microwave

Metal Back PCB

Flex / Flex-Rigid

Thermal Management

Embedded Components

Heat-sink

Semiflex

BGA/IC-Substrate

Hybrid

Partial hybrid

Ultra HDI

Track

Track:  Min track  0,025mm 

Gap

Min Gap 0,025mm

Plated Through Holes (PTH)

Min PTH: 0,050mm

Copper Thickness

Base CU 3um(1/11oz) – 700um (20 oz)

Holes

Min Through Hole size: < 0,1 mm

Material requirements

Low X/Y and Z CTE

Thermal Conductive Material

Thermally conductive > 3.0 >= 7.0 w/m-k

Board thickness

Board thickness 6+ mm

Plated over Filled Vias

IPC-4761 Type VII 

Panel size

Standard 457 x 609 mm (larger available on demand)

Long size PCB

1350mm for Plated Through Holes – ask us for MultiLayer, Flex etc

Via span

Microvia 5n5 

Microvia Any layer build

Microvia copper filled

Microvia filled and overplated

Microvia stacked

Microvia staggered

Press Fit holes

Castellation holes

Countersink

Counterbore

Backdrill

Mixed UltraHDI/HDI

Reports

TFC

PPAP

AS9100 FAIR

Controlled Impedance Report

Manufacturing Readiness Report

RoHS

REACH

Conflict Minerals Report

Code Of Conduct

Files

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