Wednesday started like a San Diego day should, clear blue skies and a big, warming sun. I can like that!
On my way into APEX I met Patty Goldman, Managing Editor of PCB007Magazine, and of course, I had to take a selfie with her.
Have you seen our column in the PCB007Magazine?
I arrived just in time for IPC President, John W. Mitchell’s keynote speech.
Mentoring and internships are the future
John talked about The challenge of Education: We need trained and capable workers
The more skills you have, the more flexible you will be. Our industry needs people with multiple skills to fill the development and changes of the job needs.
Millennials – those born with mobile phones – want a challenging job, being recognized, have fun, and they change job fast if not satisfied.
He believes we must encourage Apprenticeships and dare to use our knowledge and mentor the coming generation. A new IPC activity is the Emerging Engineer Program, where leaders are mentoring newcomers and provide them with the tools they need to continue standards. John said this kind of education will be more and more important and can be partly virtually.
After the keynote speech, I went to the IPC 2581 meeting. I quickly understood that I have to be a regular member and read the working draft. By that, I can discuss better how to link or even replace parts of 2581 with CircuitData.
Another handbook to update
Next meeting was the solder mask performance task group, and that was a good meeting. My new friends Andrew Goddard and Joe Russeau were there. My contribution to the meeting was to describe requirements to white solder mask for LED, add black solder mask processing and design parameters to the solder mask handbook, and to describe pretreatment requirements to achieve required adhesion. I also mentioned the need for a UV bump for PCBs with Immersion Tin.
During the awards luncheon, I was asked by Dr. Martin Anselm at Rochester Institute of Technology to teach the students on IPC-6012DA in a web meeting upfront a student trip to Germany.
Cold joining and press-fit
After lunch, I joined the Cold Joining / press-fit group. I was part of the establishment of this group at Electronica 1,5 years ago, but have not been active since. But, this is a very interesting group, and very relevant for the Automotive Addendum.
We split up into two smaller groups, and I joined the PCB requirements group. We had a good discussion and came to quite fundamental changes that need fine tuning, so I volunteered to join a smaller group together with some Americans and Hans-Peter Tranitz from Continental, that shall pencil out the requirements for PCBs with press fit that shall survive harsh environments.
And by that, we reached the end of day 5, eh..almost. I met up at DfR Solutions stand at the exhibition and discussed CTE predictions related to materials and design. A theme so interesting it will have its own blog post later.
Tomorrow I have my first UL Technical Panel meeting and I have a few people to catch up with before I leave San Diego Friday morning.
Missed last days blog post? Read it here.